During its CES 2022 presentation, AMD revealed that it plans to release its Ryzen 7 5800X3D to better compete with the excellent gaming performance offered by Intel’s robust 12th generation CPUs and especially the 12900K. Coins Prior to the revelation, we expected AMD to release 3D versions of its 5900X and 5950X processors. AMD had previously demonstrated the 5900X prototype, but according to Digitimes, the manufacturing limitations are probably due to the fact that we are only seeing the 5800X3D right now.
Sources at Digitimes point out that TSMC’s 3D SoIC technology is not yet in volume production and how low capacity is being preferred there for enterprise chips. However, TSMC is building a new state-of-the-art packaging plant in Chunan, Taiwan that is expected to go online later this year, but it is not fast enough for volume 5800X3D production before the introduction of Zen 4 later this year. Can come
AMD believes that adding all this extra L3 cache will add a healthy duplication of gaming performance above the Base 5800X, which is not a slash at all. The idea is that late-sensitive applications, such as games, often benefit from not having access to DRAM. AMD says the technology could add up to 15% more performance, which is enough to keep it above 12900K, but we’ll keep that in mind until we test the 5800X3D ourselves.
3D packaging is still a brand new front in chip design, but it is clear that both AMD and Intel are working on the technology. Everything from chips including stacked cache to die-on die and all the ways to distribute blocks and disconnected circuits in different dyes are on the company’s roadmap.
The Ryzen 7 5800X3D is set to launch in the spring of 2022, so there are still months to wait. If TSMC’s production capacity continues until mid-2022 or later, it is possible that the 5800X3D will remain a specific CPU. It is set to be phased out by Zen 4 CPUs after 2022.